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A compact high-speed X-ray atomic force microscope has been developed for in situ use in normal-incidence X-ray experiments on synchrotron beamlines, allowing for simultaneous characterization of samples in direct space with nanometric lateral resolution while employing nanofocused X-ray beams. In the present work the instrument is used to observe radiation damage effects produced by an intense X-ray nanobeam on a semiconducting organic thin film. The formation of micrometric holes induced by the beam occurring on a timescale of seconds is characterized.

Supporting information

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Portable Document Format (PDF) file https://doi.org/10.1107/S1600577516011437/fv5050sup1.pdf
The instrument's ability to characterize radiation damage at the short and fast timescales, as well as its ability to image in liquid environment

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Windows Media Video (WMV) file https://doi.org/10.1107/S1600577516011437/fv5050sup2.wmv
High-speed movie (3.3 images per second) obtained ex situ with the fast scanner on a silicon sample calibration grating


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