Aging-time-resolved in situ microstructural investigation of tin films electroplated on copper substrates, applying two-dimensional-detector X-ray diffraction

Pure thin tin films, electroplated on copper substrates, were investigated by in situ X-ray diffraction analysis during room-temperature aging, using a laboratory diffractometer equipped with a two-dimensional detector. By tracing diffraction spots of single Sn grains in the Sn films over time using the diffraction method adopted, it was possible to shed light on local microstructural changes in the films such as grain rotation, grain growth and grain dissolution.