Non-ambient X-ray diffraction residual stress analysis of thin films: tracing nanosize-related effects on thermoelastic constants and identifying sources of residual stresses

Pitfalls during non-ambient X-ray diffraction stress analysis of thin films (with nanosized grains) are discussed. Recipes for identifying nanosize-related effects on thermoelastic constants and various sources of residual stresses are provided.

Determination of depth gradients of grain interaction and stress in Cu thin films

The depth gradients of grain interaction and stress in Cu thin films were determined by X-ray diffraction stress measurements at fixed penetration depths. The effects of the surface roughness and the refraction of the incident beam were illustrated on the basis of a comparison of synchrotron and laboratory measurements, utilizing the corresponding variation in wavelength for tuning the absorption.