Etude par diffraction des rayons X et microscopie électronique en transmission d'un alliage Cu-1,35 at.% Sn déformé par compression

A Cu-1,35 at. % Sn alloy is deformed by compression up to a degree of deformation reaching 45%. The X-ray diffraction study of the bulk specimens thus deformed makes it possible to follow the evolution of elements such as the lattice parameter, the residual stresses and r.m.s. strains, the particle size, dislocation density and the stacking-fault probability in terms of the deformation. The different results observed are compared with those obtained when studying pure Cu as well as the above-mentioned alloy deformed by filing at room temperature. When bulk specimens were studied by transmission electron microscopy, the dislocation density was measured. An approximate method of determination of the stacking-fault energy in this alloy, which presents no extended nodes, is also described.