J. Appl. Cryst. (2004). 37, 585-588 [ doi:10.1107/S0021889804011501 ]
Abstract: Lateral deformations caused by argon ions with energy 180 keV implanted in silicon are investigated by the X-ray interferometric method. By means of interferometric topograms, relative deformations and integral stresses are determined depending on radiation dose. Maximum local stresses are assessed to be
x(max) = 8.4 × 107 N m-2 and
y(max) = 6.7 × 107 N m-2.
Keywords: interferometry; deformation fields; ion implantation.
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